IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

Product Details

Edition:
3.0
Published:
07/14/2020
Number of Pages:
17
File Size:
1 file , 1000 KB